stackeddies

 Three-d ics have been first efficaciously   best stacked dies Malaysia  demonstrated in eighties japan, in which research and improvement (r&d) on three-d ics was initiated in 1981 with the "three dimensional circuit detail r&d mission" by using the research and development affiliation for future (new) electron devices.there have been to begin with  varieties of 3-d ic design being investigated, recrystallization and wafer bonding, with the earliest successful demonstrations the usage of recrystallization. in october 1983, a fujitsu studies group including  integrated circuit, the usage of laser beam recrystallization. It consisted of a shape wherein one sort of transistor is fabricated immediately above a transistor of the other type, with separate gates and an insulator in among.  A double-layer of silicon nitride and phosphosilicate glass (psg) film become used as an intermediate insulating layer among the top and bottom devices. This furnished the idea for figuri